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Taiwan Semiconductor Manufacturing Company’s first U.S. chip fabrication facility in Phoenix, Arizona is reportedly achieving higher chip production yields compared to similar fabs in Taiwan, potentially offsetting costs. Despite delays at planned Arizona facilities, TSMC is eligible for up to $6.6 billion in grants and $5 billion in loans from the Biden administration. TSMC’s CEO stated that their first U.S. fab is producing chips for Apple and has entered engineering wafer production with 4-nanometer technology, marking an important milestone for the company.
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