SK Hynix has launched mass production of the world’s first 12-layer HBM3E memory with a capacity of 36GB, achieved by reducing the thickness of each DRAM chip by 40%. The memory offers a bandwidth of 9600 MT/s and is ideal for LLMs and AI workloads. Nvidia and AMD are expected to use the HBM3E in their advanced hardware, with SK Hynix prioritizing supply to Nvidia for AI applications.
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