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Intel announced a significant delay in the construction timeline of its Ohio One semiconductor manufacturing site in New Albany, pushing the completion of the first and second phases to 2030 and 2031, respectively. Despite setbacks, the ambitious project aims to house up to eight fabrication plants on a 1,000-acre campus, utilizing advanced process technologies and ASML’s High-NA EUV lithography tools. The delay allows Intel to navigate industry challenges and manage capital expenditures effectively, with a focus on returning to profitability and flexibility in scaling up production when market conditions improve.
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